MTS560T
Transcend's industrial M.2 DRAM-less SSD MTS560T features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency. The MTS560T can operate in an extended temperature range from -20°C to 75°C. Its space-saving M.2 form factor is ideal for space-limited devices. It is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles.
Technologies
- 112-layer 3D NAND Flash
- 30µ" PCB Gold Finger
- Corner Bond
- Extended Temperature
- Dynamic Thermal Throttling
- Thermal Sensor
- Read Disturbance
- Garbage Collection
- Wear Leveling
- TRIM
- Bad Block Management
- Early Move
Firmware Features
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
Hardware Features
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (42mm) - ideal for mobile computing devices
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
- Supports Transcend SSD Scope software
