Storage Drives

MTS560T

Transcend's industrial M.2 DRAM-less SSD MTS560T features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency. The MTS560T can operate in an extended temperature range from -20°C to 75°C. Its space-saving M.2 form factor is ideal for space-limited devices. It is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles.

Technologies

• 112-layer 3D NAND Flash
• 30µ" PCB Gold Finger
• Corner Bond
• Extended Temperature
• Dynamic Thermal Throttling
• Thermal Sensor
• Read Disturbance
• Garbage Collection
• Wear Leveling
• TRIM
• Bad Block Management
• Early Move

Firmware Features

• Built-in LDPC ECC (Error Correction Code) functionality
• Advanced Global Wear-Leveling and Block management for reliability
• Advanced Garbage Collection
• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
• TRIM command for better performance
• NCQ command for better performance

Hardware Features

• Compliant with RoHS 2.0 standards
• Space-saving M.2 form factor (42mm) - ideal for mobile computing devices
• Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
• Key components fortified by default with Corner Bond technology
• 30µ" PCB gold finger
• Promised operational reliability in an extended temperature range (from -20°C to 75°C)
• Supports Transcend SSD Scope software

The pearl white JetFlash 170 makes fast data transfer possible in any situation. Thanks to its use of SLC Flash technology, the JetFlash 170 offers peak performance and long-term reliability, operating effectively in the most demanding conditions. Its elegant design features streamlined contours and a smooth white finish, complete with a neat blue color band.

PATA Flash Module (44 Pin Horizontal)

Transcend's 44-pin PATA Flash Modules can be inserted directly to the PATA (IDE) interface of a motherboard to replace conventional 2.5" hard disk drives. Ideal for use as bootable drives, the 40-pin PATA Flash Modules are an easy solution for integrating SSD storage technology into laptop-based legacy systems.

Transcend's M.2 SSD MTS570T features the SATA III 6Gb/s interface and the state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTS570T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20?~75?.

Transcend also offers the MTS570T-I with wide temperature (-40? ~ 85?) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.

Transcend's MTS602M with SATA III 6Gb/s interface and ultra compact dimensions make it best suited to address the high-performance needs and strict size limitations of small form factor devices. This means it is perfect for use in today's modern ultrabooks, thin and light notebooks, and tablets. Built with the latest SATA III 6Gb/s specifications, and with a powerful controller and exceptional transfer speeds, the M.2 SSD easily handles everyday computing tasks as well as demanding multimedia applications.

Transcend also offers the MTS602I with wide temperature (-40? ~ 85?) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.

Technologies

• 30µ" PCB Gold Finger
• Corner Bond
• Wide Temperature
• Thermal Sensor
• Read Disturbance
• Garbage Collection
• Wear Leveling
• TRIM
• Bad Block Management
• Early Move

Firmware Features

• Built-in BCH ECC (Error Correction Code) functionality
• Advanced Global Wear-Leveling and Block management for reliability
• Advanced Garbage Collection
• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
• TRIM command for better performance
• NCQ command for better performance
• Full drive encryption with Advanced Encryption Standard (AES) (optional)
• Power-saving DevSleep (Device Sleep) mode

Hardware Features

• Compliant with RoHS 2.0 standards
• Space-saving M.2 form factor (60mm) - ideal for mobile computing devices
• DDR3 DRAM Cache embedded
• MLC NAND flash
• Key components fortified by default with Corner Bond technology
• 30µ" PCB gold finger
• Promised operational reliability in a wide temperature range (from -40°C to 85°C)
• Supports Transcend Scope Pro software