Storage Drives

Transcend's M.2 SSD MTE712A is a self-encrypting drive (SED) that complies with the TCG Opal 2.0 standards. Data is protected using the hardware-based AES 256-bit encryption and LBA (Logical Block Address)sector-specific permissions.

The MTE712A features the 112-layer 3D NAND flash and the PCI Express (PCIe) Gen 4 x4 interface, achieving never-before-seen transfer speeds. Its built-in DRAM cache allows faster random speeds while the 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistor guarantee its reliability in harsh conditions. The MTE712A is fully tested in-house, operating stably in an extended operating temperature ranging from -20?~75?.

Transcend also offers the MTE712A-I with wide temperature (-40?~ 85?) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.

Transcend MTS Series with the next generation SATA III 6Gb/s interface and ultra compact dimensions make it best suited to address the high performance needs and strict size limitations of small form factor devices. This means it is perfect for use in today's modern Ultrabooks, thin and light notebooks, and tablets. As the needs for memory space have increased, the MTS series features outstanding storage capacity ranging from 32GB to 512GB. With the latest SATA III 6Gb/s specification, powerful controller and exceptional transfer speeds, the M.2 SSD easily handles everyday computing tasks as well as demanding multimedia applications.

Transcend's MTS400I with SATA III 6Gb/s interface and ultra compact dimensions make it best suited to address the high-performance needs and strict size limitations of small form factor devices. This means it is perfect for use in today's modern ultrabooks, thin and light notebooks, and tablets. Built with the latest SATA III 6Gb/s specifications, and with a powerful controller and exceptional transfer speeds, the M.2 SSD easily handles everyday computing tasks as well as demanding multimedia applications.

MTS560T & MTS560T-I

Transcend's industrial M.2 DRAM-less SSD MTS560T features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency. The MTS560T can operate in an extended temperature range from -20°C to 75°C. Its space-saving M.2 form factor is ideal for space-limited devices. It is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles.

Transcend also offers the MTS560T-I with wide temperature (-40? ~ 85?) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.

Hardware Features

• Compliant with RoHS 2.0 standards
• Space-saving M.2 form factor (42mm) - ideal for mobile computing devices
• Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
• Key components fortified by default with Corner Bond technology
• 30µ" PCB gold finger

Firmware Features

• Built-in LDPC ECC (Error Correction Code) functionality
• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
• Advanced Garbage Collection
• Advanced Global Wear-Leveling and Block management for reliability
• NCQ command for better performance

Transcend's MTS602M with SATA III 6Gb/s interface and ultra compact dimensions make it best suited to address the high-performance needs and strict size limitations of small form factor devices. This means it is perfect for use in today's modern ultrabooks, thin and light notebooks, and tablets. Built with the latest SATA III 6Gb/s specifications, and with a powerful controller and exceptional transfer speeds, the M.2 SSD easily handles everyday computing tasks as well as demanding multimedia applications.

Transcend also offers the MTS602I with wide temperature (-40? ~ 85?) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.

Technologies

• 30µ" PCB Gold Finger
• Corner Bond
• Wide Temperature
• Thermal Sensor
• Read Disturbance
• Garbage Collection
• Wear Leveling
• TRIM
• Bad Block Management
• Early Move

Firmware Features

• Built-in BCH ECC (Error Correction Code) functionality
• Advanced Global Wear-Leveling and Block management for reliability
• Advanced Garbage Collection
• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
• TRIM command for better performance
• NCQ command for better performance
• Full drive encryption with Advanced Encryption Standard (AES) (optional)
• Power-saving DevSleep (Device Sleep) mode

Hardware Features

• Compliant with RoHS 2.0 standards
• Space-saving M.2 form factor (60mm) - ideal for mobile computing devices
• DDR3 DRAM Cache embedded
• MLC NAND flash
• Key components fortified by default with Corner Bond technology
• 30µ" PCB gold finger
• Promised operational reliability in a wide temperature range (from -40°C to 85°C)
• Supports Transcend Scope Pro software